Product Innovation

Equipment

  1. Automatic Multiple Stations Solder Dipping
  2. Belt Line Plating System
  3. Electro-less Plating System
  4. Multipurpose Linear Etch Bench
  5. Multiple Station Semiconductor Wafer Processing System
  6. Single Station Scissor Hood System
  7. Etch Hood with Motor Drive Rotary Swing Arm
  8. Dual Stations DI Quick Dump Wet Bench
  9. Chemical Delivery System
  10. Chemical Deflash/Electro Deflash, High Pressure Waterjet System
  11. Electro Strip Plating System

Unican Chemical Products

  1. Electro Deflash Chemical (EX DEFLASHER)
  2. Dipping Deflash Chemical (EX-CDA)
  3. Pure Tin Plating Chemical (MS ACID, MS Tin, T-HSM Additive)
  4. Sn/Ag Plating Chemical for Wafer Bumping ( EXTSB-119)
  5. Anti Tarnish for lead frame silver plating (TANOL 2008)
  6. Anti Tarnish for Tin Plating (TANOL SN)
  7. Electro Belt Stripper (EX STRIPPER)
  8. Electroless Belt Stripper (NBS-10)
  9. Photo Resist Stripper (PR STRIPPER)
  10. Ti Etchant for wafer (Ti Etchant)
  11. Immersion Tin (EX-IT2040)

Contact Us if you have any queries regarding the products!