Automatic Multiple Stations Solder Dipping
This is a unique system with low operation costs.
The wave solder pot was developed with only 20kg of solder. Motion through the wave solder pot is handled by an X and Z axis robot.
The versatile operating program enables finetuning to the best parameters at each step of the process such as rinsing, ultrasonic rinsing and hot dryer stage. This data can be stored in the system memory for future usage.
Belt Line Plating System
We have a series of patented plating belts for various semiconductor lead frames.
Specialized components allow handling of frames with various thickness and high pressures up to 800 bar with a diamond nozzle.
We also solved the belt contact block problem, reducing tin burr and improving plating quality.
Operating errors are minimized with an in-built industrial PC with automated recipe selection via barcode recognition.
Auto Electro-less Plating System
This is an automatic electroless immersion tin plating system for the MLP package.
A plating system that simplifies the transfer process.
Instead of having to detach units, wafer rings can now be directly transferred from the sawing process to the immersion tin.
Multipurpose Linear Etch Bench
This system reduces the footprint of wafer processing.
By using a servo drive swing arm, the transfer of wafer basket from the Chemical tank to the Quick Rinse tank is done with rotation motion, instead of linear motion.
This reduces time lost between transfer, hence improving performance and minimizing yield loss.
The flexible system also allows it to be used as either an etch bench or wafer cleaning hood.
Multiple Station Semiconductor Wafer Processing System
The innovative Multiple station wafer processing system creates a more streamlined and efficient way to complete wafer processing. This system is built with FM 4910 approved material.
Operation error is eliminated with an automated barcoding software with multiple recipe system.
In each recipe, 10 different processes are included and executed by an intelligent robot.
The use of robots throughout the entire process allows multiple lots to be loaded simultaneously, improving throughput and productivity.
Single Station Scissor Hood System
In this wafer processing system, a swing arm is used to transport wafer to the acid tank for etching or cleaning with DI rinse.
The process time, cycle and etch rate will be automatically tabulated.
Etch Hood with Motor Drive Rotary Swing Arm
A multipurpose machine that allows multiple processes to be performed in a single control system.
Dual Stations DI Quick Dump Wet Bench
Features
1. Barcode reader control for lot control and tracking
2. User ID control for traceability
3. Barcode reader control for tank selection
4. Touch screen recipe edit
Chemical Delivery System
This system can automatically dispense multiple chemicals to the desired hood.
Chemicals can be transported over long distances between the chemical store and production area through a handshake protocol.
Chemical Deflash/Electro Deflash, High Pressure Waterjet System
This system is designed for versatility to handle most lead frame mold flashes.
By having 2 Chemical deflash tanks and an ED cell, flashes can be removed by either Electro-deflash, Chemical-deflash (CD soak) with waterjet, or both processes.
At the same time, the inline design reduces production costs, operation costs and floor space.
Electro Strip Plating System
We developed an automatic strip plating machine with HMI control of parameter and recipe selection.
This system is built with 2 high pressure water jet stations for flash removal and 1 tin burr removal station.
Our versatile system can convert various package lengths between frame widths of 45mm to 100mm, and frame lengths of 220mm to 300mm. Additionally, it can also process copper lead frames between thickness of 0.2mm to 2.5mm.